Dec.1949 Company founded. Jan.1950 Manufacture and sale of oil-filled paper capacitors began. Dec.1957 Manufacture and sale of type MFL plastic film capacitors(now type 501) began. Jan.1959 Manufacture and sale of type TAC tantalum wet electrolyte capacitors began. Dec.1959 Manufacture and sale of Japan's first type TAF dipped tantalum solid electrolyte capacitors began. Aug.1960 Manufacture and sale of type TAX metal encased tantalum solid electrolyte capacitors(now type 111) began. Dec.1962 Tantalum capacitor's mass production plant established in Osaka. Jan.1968 Manufacture and sale of UNICAP molded tantalum solid electrolyte capacitors began. Sep.1968 Manufacture and sale of MICROCAP tantalum chip solid electrolyte capacitors began. Dec.1970 Shimane Matsuo Electronic Co.,Ltd. founded. Apr.1971 Manufacture and sale of type TCA molded chip tantalum capacitors began. Sep.1972 Matsuo Electronics of America,Inc. founded in USA. May.1974 Manufacture and sale of type UPF polypropylene film capacitors (now type 602) began. 　 Jun.1974 Listed in the second section on the Osaka Stock Exchange. Apr.1976 Manufacture and sale of type 202 compact dipped tantalum solid electrolyte capacitors began. 　 Oct.1979 Manufacture and sale of type 204 high-relibility dipped tantalum capacitors began. 　 Feb.1981 Manufacture and sale of type 553 ultra-small encased polyester film capacitors began. 　 Jun.1982 Manufacture and sale of type 311 tantalum wet electrolyte capacitors began. 　 Mar.1983 Fukuchiyama Plant founded in Fukuchiyama City,Kyoto. Feb.1984 Manufacture and sale of type 267 compact tantalum chip capacitors began. Dec.1985 Manufacture and sale of type 269 integral-fuse solid electrolyte tantalum capacitors began. Jul.1986 Manufacture and sale of type 277 low-profile tantalum chip capacitors began. Jan.1987 Manufacture and sale of type 801 PPS film capacitors began. Jun.1989 Manufacture and sale of type 503 ultra-compact dipped PET film capacitors began. Aug.1990 Matsuo Electronics Europe founded in Germany. Dec.1991 Manufacture and sale of type 551 ultra-compact encased metalized polyester capacitors began. Jun.1994 Manufacture and sale of type 278 ultra-compact tantalum chip capacitors began. Mar.1995 Our Fukuchiyama Plant was awarded ISO 9002 certification, the international standards of quality management system. Jun.1996 Manufacture and sale of type JAA chip circuit protectors began. Mar.1997 Manufacture and sale of type KAB micro fuse began. May.1999 Fukuchiyama Plant awarded the Quality System Requirements QS-9000 certification. May.2000 Manufacture and sale of type 251 ultra-miniature tantalum chip capacitors with facedown terminal structure began. Sep.2000 Awarded the Environmental management systems ISO14001:1996 certification. Feb.2002 Manufacture and sale of size 1005 type KAC micro fuse began. Oct.2003 Development of size 0603 type KAG micro fuse. Dec.2003 Our Fukuchiyama Plant was awarded ISO 9001:2000 certification for Quality Management System,upgrade from ISO 9001:1994. Aug.2005 We were awarded updated ISO14001:2004 certification for Environmental Management Systems. June.2006 Manufacture and sale of type ACA aluminum solid electrolytic capacitors with conductive polymer began. Aug.2006 Awarded the Quality management systems ISO/TS16949:2002 certification . Oct.2006 Manufacture and sale of type TCA and TCB tantalum solid electrolytic capacitor with conductive polymer began. Feb.2007 Manufacture and sale of type KVA surge absorber for ESD protection began. Jan.2010 Manufacture and sale began of type 252 and 267N tantalum chip capacitors, which conform to the AEC-Q200 international automotive electronics testing qualification. Back to Top of page.